Arctic Silver II, 3 gram
Item#: EAS2-3G

Points Credit : 3 points Currently valued at $0.05

Introducing Arctic Silver II, the improved version of the first premium silver thermal compound specifically designed to maximize the thermal conductivity between today's high-power processors and high-performance heatsinks.

Arctic Silver II features:

Made with 99.8% pure micronized silver.

78% to 82% silver content by weight.

Extended temperature limits: ? 40?C to >160?C

New formula insures minimal viscosity change from 0C to 150C

Thermal conductivity: 8.4 W/m?K to 8.8 W/m?K (Hot Wire Method Per MIL-C-47113)

Thermal Resistance: 0.0028?C-in?/Watt (0.001 inch layer)

2 to 7 degrees centigrade lower CPU core temperatures than other thermal compounds.

Negligible electrical conductivity.
Arctic Silver II was formulated to conduct heat, not electricity. It is only electrically conductive in a thin layer under extreme compression.

(While much safer than electrically conductive silver and copper greases, Arctic Silver II should be kept away from electrical traces, pins, and leads. The compound is slightly capacitive and could potentially cause problems if it bridged two close-proximity electrical paths.)

Arctic Silver II is now sold in 3 gram tubes. This is enough compound to cover at least 20 to 30 small CPU cores, or 7 to 12 large CPU cores, or 3 to 6 heat plates.
At a layer 0.003" thick, it will cover approximately 18 square inches.


Important Reminder

Due to the unique shape and sizes of the silver particles in Arctic Silver II, it will take a minimum of 48 hours to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will drop as much as 2C to 4C over this "break-in" period.

Caution:
We do not recommend using Arctic Silver 2 on the older Intel Xeon processors with large multiple square inch CPU to heatsink interfaces. The huge contact area and large gaps between the processor and the heatsink require a thermal pad or thick mesh-reinforced paste.